Carlos Barria | Reuters
The agreement, announced by Apple on Wednesday, will lead to the production of more than 15 billion U.S.-made chips and includes a $1.5 billion expansion of Broadcom’s facility in Fort Collins, Colorado. Apple didn’t provide a timeline for when the new capacity will come online.
Broadcom has long supplied Apple with connectivity components, but the new agreement deepens that relationship around U.S.-made custom silicon. Apple said Broadcom will make wireless components used to help devices connect to cellular, Wi-Fi and Bluetooth networks.
Broadcom disclosed in a filing with the Securities and Exchange Commission on Monday that it had entered into new long-term agreements with Apple to develop and supply “custom ASIC silicon products” for multiple generations of Apple products through 2031. ASICs are application-specific integrated circuits and are increasingly being used for artificial intelligence workloads.
“Apple has been working with the Administration and businesses across the U.S. to help create an end-to-end silicon supply chain in America, and today’s announcement advances those efforts,” Apple said in the release.
Cook said the components built in Fort Collins are “essential” to the performance and connectivity Apple customers expect, and he thanked President Donald Trump and his administration for supporting the project.
Broadcom CEO Hock Tan said Apple’s commitment will help the chipmaker expand its manufacturing footprint in Fort Collins.
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